PCB / ENCLOSURES / HARDWARE


AEM Components


CIRCUIT PROTECTION: 
SURFACE MOUNT CIRCUIT PROTECTIVE COMPONENTS:  Solid Matrix Fuse, AirMatrix Fuse, Polymer Resettable Fuse, GcDiode ESD Suppressor, Multilayer Varistors
SURFACE MOUNT INDUCTIVE COMPONENTS: Multilayer Ferrite Chip Beads, Multilayer Ferrite Power Beads, Multilayer Ferrite/Ceramic Inductors, ThinFilm Inductors      



KAN YANG


KANG YANG INTERNATIONAL - HARDWARE & ACCESSORIES:  
ELECTRONIC HARDWARE: PCB spacers & supports, LED light pipes & holders, plastic rivets, rubber feet.
CABLE ROUTING & MANAGEMENT: Snap in & adhesive base clips, clamps, braided sleeving & heat shrink tubing
PCB & ENCLOSURE ACCESSORIES:  PSU handles, vibration mounts, grommets, bushings, card guides, & ejectors.
    

KOA Speer

KOA SPEER ELECTRONICS - YOUR PASSIVE COMPONENTS PARTNER
RESISTORS: SMT, Current Sensing, Shunt, Resistor Arrays and Integrated Networks, Leaded and Melf type 
EMI/EMC: SMT Ferrite Beads, Fuses and Varistors; LTCC Modules/Substrates; SENSORS: SMT Thermal Sensors
INDUCTORS: Power and SMT; CAPACITORS: Ceramic Chip 


www.harwin.com


HIGH-RELIABILITY CONNECTORS AND PCB HARDWARE: 
CONNECTORS: STD & Shrouded Headers, Board-to-Board, Wire-to-Board, Plug & Socket
DATAMATE - GECKO:  High Reliability 2.00mm & 1.25mm, Mixed Signal up to 40A, Cable Assemblies
EZ-BoardWare: RFI Shields Cans/Clips, Spring Contacts, Battery Holders, Terminals and Test Points


PAL PILOT

PRINTED CIRCUIT BOARDS:
PCB DESIGN, LAYOUT AND FABRICATION, SIGNAL INTEGRITY TESTING AND DESIGN








Wakefield-Vette






THERMAL MANAGEMENT SOLUTIONS: 
NATURAL CONVECTION: Heat Sink Extrusions, Board Level & BGA, LED, Folded/Bonded/Stacked Fin, SCR Heat Sinks & Clamp Assemblies
FORCED AIR CONVECTION: Fan Heat Sinks, Skived Fin, Zipper Fin
LIQUID COOLING: Liquid Cold Plates, Heat Pipes, Heat Exchangers, Coolant Distribution Units 
THERMAL INTERFACE MATERIALS: Adhesives, Tapes, Gap Pads, Compounds, Phase Change

RACK MOUNT HARDWARE & SYSTEM EXTRUSIONS: 
WEDGELOCKS: Locking Card Retainers
ENCLOSURES:  Extruded Enclosures, Front Panels



ELECTRONIC PACKAGING SYSTEMS featuring HEITEC :
SYSTEM CHASSIS: MicroTCA, TCA, AMC, CompactPCI, VME
PACKAGING SYSTEMS: Enclosures, Front Panels, Guide Rails, Backplanes 

WP


RELAYS: NEC-Tokin Miniature Signal Relays, WPI Industrial Relays.
SURGE PROTECTION: WPI MOV's, Thermal Multilayer Varistors, Gas Tubes, TVS Diodes, Thyristors.
PILKOR: X & Y Capacitors, WPI Film Capacitors
LITE-ON: Bridge Rectifiers.